Processing Parameters’ Effect on Full-field Temperature

Using patent-pending solver to simulate the full-field temperature track-by-track and layer-by-layer and predict the effects of the key processing parameters, e.g. the heat source energy input and its diameter, scanning speed and relevant acceleration and deceleration, deposit strategy/pattern etc., on the temperature field changes, including the temperature gradient and cooling rate. The fundamental of the L.A.M.P.S. software can see the LAMPS users’ manual (click to download the manual). LAMPS is copyright protected software (No. Tx 8-153-990, No.TXu 2-074-473)

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Full-scale AM Thermomechanical Response

Based on the full-scale temperature field change and metal solidification shrinkage characteristics, the Layerwise Additive Manufacturing Predictions and Simulations (L.A.M.P.S.) software can simulate the full-scale thermomechanical response by using our pending-patent technique and layerwise 3D mechanical model during the Additive manufacturing procedure. The three-dimensional shrinkage deformation caused by solidification are fully considered by our thermo-mechanical model and solver. For more information about the fundamental, please see the LAMPS software user’s manual(click to download the manual).